Cooperation Agreement for
Small Form-Factor Pluggable Transceivers
Agilent
Technologies, Blaze Network Products, E2O Communications, Inc.,
ExceLight
Communications, Finisar Corporation, Fujikura Technology America Corp.,
Hitachi Cable,
Infineon Technologies Corp., IBM Corp., Lucent Technologies,
Molex, Inc.,
Optical Communication Products, Inc., Picolight, Inc.,
Stratos Lightwave, Tyco Electronics
I.
Purpose of the
Cooperation Agreement (Agreement)
Each party desires to establish internationally
compatible sources of a pluggable fiber optic transceiver module in support of
standards for fiber optic systems including Asynchronous Transfer Mode (ATM),
FDDI, Fibre Channel, Fast Ethernet and Gigabit Ethernet, and Synchronous
Optical Network (SONET) / Synchronous Digital Hierarchy (SDH) applications.
Each party further desires to establish uniformity
in the industry for the Transceiver “Package Dimensions”, “Cage and Electrical
Connector System”, “Host Board Layout”, “Electrical Interfaces”, and “Front
Panel Bezel Requirements” as described in Appendices A-B.
Each party expects that the establishment of compatible
sources for an interchangeable transceiver module will allow the entire fiber
optic marketplace to grow more rapidly.
This enhanced marketplace growth, customer choice, and vigorous
competition are the express purposes of this Agreement. Each
party acknowledges this agreement provides a solution with height as a primary
limiting constraint and may not provide an optimum solution for applications
with different constraints.
The parties desire to establish compatible sources
for additional products in the future.
II.
Agreement
A. General
The parties agree to
cooperate by supporting common product specifications for pluggable fiber optic
transceivers with the package “Package Dimensions”, “Cage and Electrical
Connector System”, “Host Board Layout”, “Electrical Interfaces”, and “Front
Panel Bezel Requirements” as shown in Appendices A-B. The overall package dimensions shall not exceed the maximum
indicated dimensions, and the mounting features shall be located such that the
products are mechanically interchangeable with the cage and connector
system. In addition the overall
dimensions and mounting requirements for the cage and connector system on a
circuit board shall be configured such that the products are mechanically and
electrically interchangeable.
The electrical and optical specifications shall be
compatible with those enumerated in the appropriate standards (i.e. the IEEE
802.3z Gigabit Ethernet standard and the ITU G.957 Synchronous Digital
Hierarchy standard). Recommended circuit layouts for electrical input and
output terminations, and grounding practices are also described in Appendix B.
The transceivers per this agreement will accept an optical connector such as the duplex
LC, MT-RJ or the SG connector. This agreement does not preclude any of the
parties from offering SFP transceivers with other connectors.
Internal design of the SFP transceiver is entirely
at the discretion of each party and is not covered by this Agreement. The parties recognize that their products
may not be identical, but need only meet the above criteria.
B.
Licensing and Fees
No license is granted under the patents, know-how,
tradesecrets or any other technology of any party to this Agreement either
expressly or by implication or by estoppel.
Each of the MSA parties have agreed that licenses to all required
intellectual property will be made available to all interested parties under reasonable
and non-discriminatory terms and conditions applicable to that MSA party. Individual parties to this Agreement may
have patents, which they believe may be relevant to this Agreement. The MSA parties should be contacted
individually to determine if they have patent rights, which they believe may be
pertinent to this Agreement. Each party
is free to seek technology or other exchanges with other firms in order to
support its activities under this Agreement.
C.
Scope of the Agreement
The scope of this Agreement
includes transceivers with transmission rates up to 5.0 Gb/s operating over
multimode and single mode fiber.
Each party agrees to be responsible for its own
development, manufacturing, marketing and selling in order to supply
transceivers meeting the attached specifications.
This Agreement does not preclude any party from
offering other products that may not meet the attached specifications.
Each party retains complete liberty regarding its
methods of implementing a supply of product, e.g., by engineering effort or by
technology licensing or transfer or combination of these or other practices.
Each party also retains sole discretion in its
choice of sales channels and distribution.
Each party affirms its intention to compete freely
and openly in the marketplace with the parties as well as other competitors.
Each party expects to support products meeting the
attached specifications for as long as marketplace conditions warrant. No specific time limit is associated with
this Agreement. The determination of
market condition suitability is to be made by each party individually and in
each party’s sole discretion.
III.
Public Announcement
A. Announcing the Agreement
Each party agrees to
announce this Agreement in a manner agreed upon by the parties. These announcements will mention all the
parties who have signed this Agreement.
Each party agrees to seek public attention by means
of such an announcement.
Each party agrees to
contribute time and effort at its sole discretion toward preparing and making
such an announcement.
B. Promotion of the Agreement
After the Agreement is
announced, each party may advertise or otherwise promote this Agreement in any
way that it deems appropriate. Mutual
consent of the other party is required if such other party is to be mentioned
by name.
IV.
Other Vendors
A. Other Vendors Matching the Product
Configuration
The parties recognize that additional vendors may
choose to match the attached product specifications after this Agreement is
announced.
Each party recognizes it is desirable and keeping
with the intent of the Agreement for such additional vendors to support the
transceiver mechanical dimensions and functional attributes described in
Appendix A.
Therefore, each party agrees
to encourage other vendors to support these product specifications.
B. Naming Other Vendors
Each party agrees to have written internal
procedures that require such party to name the other parties when customers ask
who intends to be a source for transceivers as described in this
Agreement. Each party agrees for such
procedures to require it to name the others regardless as to whether another of
the parties has already supplied similar transceiver products to that customer.
An example of suggested wording is: “Agilent, Blaze
Networks, E2O, ExceLight, Finisar, Fujikura, Hitachi Cable, Infineon, IBM,
Lucent, Molex, OCP, Picolight, Stratos Lightwave, and Tyco have signed a
Cooperation Agreement relating to the establishment of Small Form-factor
Pluggable transceivers for multimode and single mode fiber operating up to 5.0
Gb/s data rates.”
The parties are not obligated to provide any
information other than the identities of the other parties. The requirements of this provision are met
entirely if a party has the aforementioned written procedures and they are made
available to its sales force in the same way as are other sales related
procedures.
V.
Future Direction
A.
Current Product
Should the parties agree to further explore technical and other
exchanges pertaining to the products described in this Agreement, then this
shall be under a separate agreement.
B.
Withdrawal
The parties recognize that
at some future time it may become less feasible to offer the products
envisioned by this Agreement. A party
may withdraw from its commitment to cooperate at its own discretion upon a 90-day
notice to the other parties. This
notice is necessary to allow the other parties to discontinue mentioning the
withdrawing part as a participant in this Agreement and to reconsider any
jointly planned promotional activities.
VI.
Limitation of
Liability
With the exception of disputes arising out of
intellectual property issues, no party to
this Agreement shall be liable for any indirect, incidental, punitive, or
consequential damages, including without limitation, lost profits or changes of
good will, or similar losses, even if advised of the possibility of such
damages. In addition, each party’s
liability under this Agreement for direct damages shall be limited to $10,000.
Appendix A. Mechanical Interface
A1. SFP Transceiver Package
Dimensions
A2. Mating of SFP Transceiver PCB to
SFP Electrical Connector
A3. Host Board Layout
A4. Insertion, Extraction and
Retention Forces for SFP Transceivers
A5. Labeling of SFP Transceivers
A6. Bezel Design for Systems Using
SFP Transceivers
A7. SFP Electrical Connector
Mechanical Specifications
A8. SFP Cage Assembly Dimensions
Appendix B. Electrical
Interface
B1. Introduction
B2. Pin Definitions
B3. Timing Requirements of Control
and Status I/O
B4. Module Definition Interface and
Data Field Description
Appendix C. Agreement
Signatures
Appendix A.
Mechanical Interface
A1. SFP Transceiver Package Dimensions
A common mechanical outline
is used for all SFP transceivers. The
package dimensions for the SFP transceiver are described in Table 1 and Figures
1A and 1B.
Table 1. Dimension Table for Drawing of SFP
Transceiver
Designator
|
Dimension
(mm)
|
Tolerance
(mm)
|
Comments
|
|
A
|
13.7
|
± 0.1
|
Transceiver
width, nosepiece or front that extends inside cage
|
|
B
|
8.6
|
± 0.1
|
Transceiver
height, front, that extends inside cage
|
|
C
|
8.5
|
± 0.1
|
Transceiver
height, rear
|
|
D
|
13.4
|
± 0.1
|
Transceiver
width, rear
|
|
E
|
1.0
|
Maximum
|
Extension
of front sides outside of cage, see Note 2 Figure 1B
|
|
F
|
2.3
|
Reference
|
Location
of cage grounding springs from centerline, top
|
|
G
|
4.2
|
Reference
|
|
|
H
|
2.0
|
Maximum
|
Width
of cage grounding springs
|
|
J
|
28.5
|
Minimum
|
|
|
K
|
56.5
|
Reference
|
|
|
L
|
1.1x45°
|
Minimum
|
Chamfer
on bottom of housing
|
|
M
|
2.0
|
± 0.25
|
Height
of rear shoulder from transceiver printed circuit board
|
|
N
|
2.25
|
± 0.1
|
Location
of printed circuit board to bottom of transceiver
|
|
P
|
1.0
|
± 0.1
|
Thickness
of printed circuit board
|
|
Q
|
9.2
|
± 0.1
|
Width
of printed circuit board
|
|
R
|
0.7
|
Maximum
|
Width
of skirt in rear of transceiver
|
|
S
|
45.0
|
± 0.2
|
Length
from latch shoulder to rear of transceiver
|
|
T
|
34.6
|
± 0.3
|
Length
from latch shoulder to bottom opening of transceiver
|
|
U
|
41.8
|
± 0.15
|
Length
from latch shoulder to end of printed circuit board
|
|
V
|
2.5
|
± 0.05
|
Length
from latch shoulder to shoulder of transceiver outside of cage (location of
positive stop).
|
|
W
|
1.7
|
± 0.1
|
Clearance
for actuator tines
|
|
X
|
9.0
|
Reference
|
Transceiver
length extending outside of cage, see Note 2 Figure 1B
|
|
Y
|
2.0
|
Maximum
|
Maximum
length of top and bottom of transceiver extending outside of cage, see Note 2
Figure 1B
|
|
Z
|
0.45
|
± 0.05
|
Height
of latch boss
|
|
AA
|
8.6
|
Reference
|
Transceiver
height, front, that extends inside cage
|
|
AB
|
2.6
|
Maximum
|
Length
of latch boss (design optional)
|
|
AC
|
45°
|
± 3°
|
Entry
angle of actuator
|
|
AD
|
0.3
|
Maximum
|
Radius
on entry angle of actuator
|
|
AE
|
6.3
|
Reference
|
Width
of cavity that contains the actuator
|
|
AF
|
2.6
|
± 0.05
|
Width
of latch boss (design optional)
|
|
AG
|
0.40
|
Minimum
|
Maximum
radius of front of latch boss, 2 places (design optional)
|
Figure 1A. Drawing of SFP Transceiver
Figure 1B. Drawing
of SFP Transceiver (Cont.)
A2. Mating of SFP Transceiver PCB to SFP Electrical Connector
The SFP transceiver contains a
printed circuit board that mates with the SFP electrical connector. The pads
are designed for a sequenced mating:
·
First mate – ground
contacts
·
Second mate – power
contacts
·
Third mate – signal contacts
The design of the mating
portion of the transceiver printed circuit board is illustrated in Figure 2 and
the electrical pad layout is illustrated in Figure 3. A typical contact pad
plating for the printed circuit board is 0.38 micrometers minimum hard gold
over 1.27 micrometers minimum thick nickel. Other plating options that meet the performance
requirements are acceptable.
Figure 2. Recommended Pattern Layout for SFP Printed Circuit Board
Figure 3. SFP Transceiver Electrical Pad Layout
A3. Host
Board Layout
A typical host board mechanical
layout for attaching the SFP Connector and Cage System is shown in Figures 4A
and 4B.
Figure
4B. SFP Host Board Mechanical Layout
(Cont.)
A4. Insertion, Extraction and Retention Forces
for SFP Transceivers
The requirement for the various functional forces and the
durability cycles are specified in Table 2.
Table 2. Insertion, Extraction, and Retention Forces
|
Measurement
|
Minimum
|
Maximum
|
Units
|
Comments
|
|
SFP transceiver insertion
|
0
|
40
|
Newtons
|
|
|
SFP transceiver extraction
|
0
|
11.5
|
Newtons
|
|
|
SFP transceiver retention
|
90
|
170
|
Newtons
|
No damage to
transceiver below 90N
|
|
Cage retention (Latch strength)
|
180
|
N/A
|
Newtons
|
No damage to
latch below 180N
|
|
Cage kickout spring force
|
11.5
|
22
|
Newtons
|
|
|
Insertion / removal cycles, connector/cage
|
100
|
N/A
|
cycles
|
|
|
Insertion / removal cycles, SFP transceiver
|
50
|
N/A
|
cycles
|
|
A5. Labeling
of SFP Transceivers
Color coding requirements for optical SFP
transceivers are specified in Figure 1B.
Each SFP transceiver should be clearly labeled. The
complete labeling need not be visible when the SFP transceiver is
installed. Labeling should include
appropriate manufacturing and part number identification, appropriate
regulatory compliance labeling, and a clear specification of the external port
characteristics. The external port
characteristic label may include such information as optical wavelength,
required fiber characteristics, operating data rate, interface standards
supported, and link length supported.
A6. Bezel Design for
Systems Using SFP Transceivers
Host enclosures that use SFP
devices should provide appropriate clearances between the SFP transceivers to
allow insertion and extraction without the use of special tools and a bezel
enclosure with sufficient mechanical strength. For most systems a nominal
centerline to centerline spacing of 16.25mm (0.640”) is sufficient. See Figure
5 for the recommended bezel design. For double-sided board mounting, a printed
circuit board thickness of 3.0mm (0.118”) is required.
The
SFP transceiver insertion slot should be clear of nearby moldings and covers
that might block convenient access to the latching mechanisms, the SFP
transceiver, or the cables connected to the SFP transceiver.
Figure 5. Recommended Bezel Design
A7. SFP Electrical Connector Mechanical
Specifications
The SFP Connector is a
20-contact, right angle surface mount connector. It is described in Table 3 and
Figure 6. The plating on the contacts is specified as follows:
·
Contact area: 0.38 micrometers minimum hard gold over 2.54 micrometers
minimum thick nickel
·
Solder terminal area:
gold flash or 2.54 micrometers tin lead plating over 2.54 minimum thick nickel.
Table 3. SFP Transceiver
Connector Dimensions
|
Designator
|
Dimension
(mm)
|
Tolerance
(mm)
|
Comments
|
|
A
|
9.4
|
± 0.08
|
Connector card slot
width
|
|
B
|
1.4
|
± 0.05
|
Guide pin diameter
|
|
C
|
11.2
|
Maximum
|
Connector width
|
|
D
|
9.2
|
Maximum
|
Connector length
|
|
E
|
3.5
|
Reference
|
Distance from
centerline of connector to outer contact
|
|
F
|
3.9
|
Reference
|
Distance from
centerline of connector to outer contact
|
|
G
|
1.35
|
Maximum
|
Connector card slot
height
|
|
H
|
2.6
|
Minimum
|
Height from bottom
of connector to bottom of card slot
|
|
J
|
9.6
|
TP
|
Distance between
guide pins
|
|
K
|
0.9
|
Reference
|
Diamond guide pin
width
|
|
L
|
1.4
|
± 0.05
|
Diamond guide pin
length
|
|
M
|
5.4
|
Maximum
|
Connector height
|
|
N
|
0.8
|
Reference
|
Length of solder
leads past housing, front & rear
|
|
P
|
6.0
|
Minimum
|
Depth of card slot
from front face of housing
|
|
Q
|
3.0
|
Maximum
|
Depth of contact
point from front face of connector
|
|
R
|
0.7
|
± 0.1
|
Size of chamfer on
top face of connector
|
|
S
|
0.3
|
Reference
|
Distance boss
extends past front face of connector
|
|
T
|
1.0
|
Minimum
|
Size of chamfer at
entry of card slot, all around
|
|
U
|
4.5
|
Reference
|
Length from
centerline of guide posts to end of solder lead
|
Figure 6. SFP Transceiver Connector Illustration
A8. SFP Cage Assembly Dimensions
The SFP Cage Assembly
consists of two components: a lower cage that is soldered to the host board and
a top cage that is assembled to the lower cage after soldering. A reference
drawing describing the SFP Cage Assembly is provided in Table 4 and Figures 7A
and 7B. The cage material is copper alloy and plating options are:
·
Tin-lead
plate 2.54 micrometers minimum over copper flash
·
Tin
plate 2.54 micrometers minimum over 0.76 micrometers minimum nickel
Table 4. Dimension Table for
Drawing of SFP Cage Assembly
|
Designator
|
Dimension
(mm)
|
Tolerance
(mm)
|
Comments
|
|
A
|
48.8
|
Maximum
|
Overall
length
|
|
B
|
8.3
|
Maximum
|
|
|
C
|
14.0
|
± 0.1
|
Inside
width of cage
|
|
D
|
14.25
|
Basic
|
Distance
between solderleg centerlines on side of cage
|
|
E
|
0.249
|
± 0.025
|
Thickness
of solderleg
|
|
F
|
9.0
|
Basic
|
Distance
between vent holes along length
|
|
G
|
11.8
|
Basic
|
Distance
from front of cage to beginning of center vent hole row
|
|
H
|
7.9
|
Basic
|
Distance
between vent holes across the width of the cage
|
|
J
|
2.0
|
± 0.1
|
Diameter
of vent holes
|
|
K
|
16.5
|
Basic
|
Distance
from front of cage to solderleg
|
|
L
|
10.0
|
Basic
|
Distance
between chassis ground solderlegs along side
|
|
M
|
0.6
|
± 0.1
|
Width
of EMI pins
|
|
N
|
0.7
|
± 0.1
|
Width
of all chassis ground solderlegs
|
|
P
|
2.0
|
Maximum
|
Width
of solderleg shoulder
|
|
Q
|
1.25
|
Maximum
|
Length
of solderleg
|
|
R
|
3.95
|
Basic
|
Distance
from centerline of cage to centerline of chassis ground solderleg
|
|
S
|
1.45
|
Basic
|
Distance
from centerline of cage to centerline of chassis ground solderleg
|
|
T
|
1.45
|
Basic
|
Distance
from centerline of cage to centerline of chassis ground solderleg
|
|
U
|
4.8
|
Basic
|
Distance
from centerline of cage to centerline of EMI pins
|
|
V
|
0.5
|
± 0.05
|
Width
of EMI pins on top cage
|
|
W
|
9.2
|
± 0.15
|
Distance
from inside top of cage to inside bottom surface of front section of cage
assembly
|
|
X
|
9.8
|
Maximum
|
Maximum
height of cage assembly from host board
|
|
Z
|
10.0
|
Basic
|
Distance
between chassis ground solderlegs along side
|
|
AA
|
11.5
|
Basic
|
Distance
from front of cage to solderleg
|
|
AB
|
7.5
|
Minimum
|
Length
of 9.2 (W) dimension from front of cage
|
|
AC
|
15.0
|
Maximum
|
Maximum
width of cage assembly
|
|
AD
|
13.9
|
Minimum
|
Minimum
width of inside of cage
|
|
AE
|
8.95
|
± 0.15
|
Height
of inside of cage assembly
|
|
AF
|
1.0
|
Minimum
|
|
|
AG
|
2.4
|
Basic
|
Distance
of clearance slots from cage centerline
|
Table 4. Dimension Table for Drawing of SFP Cage
Assembly (Cont.)
|
Designator
|
Dimension
(mm)
|
Tolerance
(mm)
|
Comments
|
|
AH
|
3.0
|
± 0.1
|
Width
of clearance slots
|
|
AJ
|
2.35
|
± 0.1
|
Distance
from front of cage to latch opening
|
|
AK
|
2.8
|
± 0.1
|
Length
of latch opening
|
|
AL
|
0.5
|
Minimum
|
Height
of latch lead-in
|
|
AM
|
45.6
|
Maximum
|
Distance
from front of cage to kickout spring
|
|
AN
|
35.0
|
Maximum
|
Distance
from front of cage to end of cage floor
|
|
AP
|
0.7
|
± 0.1
|
Width
of solderlegs that extend from floor of cage
|
|
AQ
|
5.1
|
Maximum
|
Width
of latch
|
|
AR
|
3.0
|
± 0.05
|
Width
of latch opening
|
|
AS
|
16.3
|
Basic
|
Front
of cage to beginning of outer vent hole rows
|
|
AT
|
0.65
|
Maximum
|
Inside
radius of cage, four places
|
|
AU
|
5.8
|
Minimum
|
Distance
between panel ground spring supports
|
|
AV
|
12.7
|
Maximum
recommended
|
Length
of plug extending outside of the cage
|
|
AW
|
15.75
|
Maximum
|
Width
of plug extending outside of the cage
|
|
AX
|
10.9
|
Maximum
|
Height
of plug extending outside of the cage
|
A9.
Dust / EMI Cover
The order to
prevent contamination of the internal components and to optimize EMI
performance, it is recommended that a Dust/EMI Plug be inserted into cage
assemblies when no transceiver is present.
The maximum dimensions of the Dust/EMI Cover are listed in Table 4 and
the maximum size is illustrated in Figure 7A.
The Dust/EMI Cover shall exert a maximum force of 4.0 Newtons per side
to the inside surfaces of the cage.
This force shall be measured as the force/side required to compress the
Dust/EMI Cover’s compliant feature(s) to the maximum dimensions listed in Table
4 (Illustrated in Figure 7A).
Figure 7A. SFP Cage Assembly
Figure
7B. SFP Cage Assembly (Cont.)
Appendix
B. Electrical Interface
B1.
Introduction
This annex contains pin definition data for the
small form-factor pluggable (SFP) transceiver. The pin definition data is
specific to gigabit rate datacom applications such as Fibre Channel and Gigabit
Ethernet. It is expected that different
pin definitions will be developed for SONET/ATM and lower data rate datacom
applications.
B2.
Pin Definitions
Figure
1 below shows the pin names and numbering for the connector block on the host
board. The diagram is in the same
relative orientation as the host board layout (see Appendix A, Figure 4.). As mentioned, this pinout only applies to
gigabit rate datacom applications. The
pin functions are defined in Table 1 and the accompanying notes. Figure 2A shows the recommended power supply
filtering network. Figure 2B shows an
example of a complete SFP host board schematic with connections to SerDes and
protocol ICs. For EMI protection the
signals to the 20-pin connector should be shut off when the transceiver is removed. Standard board layout practices such as
connections to Vcc and GND with Vias, use of short- and equal-length
differential signal lines, use of microstrip-lines and 50W terminations are recommended. Chassis grounds and external electromagnetic interference shields
should not be attached to circuit ground.
Figure 1.
Diagram of Host Board Connector Block Pin Numbers and Names
Table 1. Pin
Function Definitions
|
Pin Num.
|
Name
|
Function
|
Plug
Seq.
|
Notes
|
|
1
|
VeeT
|
Transmitter
Ground
|
1
|
|
|
2
|
TX Fault
|
Transmitter
Fault Indication
|
3
|
Note 1
|
|
3
|
TX Disable
|
Transmitter Disable
|
3
|
Note 2
Module disables on high or open
|
|
4
|
MOD-DEF2
|
Module
Definition 2
|
3
|
Note 3, 2 wire
serial ID interface
|
|
5
|
MOD-DEF1
|
Module Definition 1
|
3
|
Note 3, 2 wire
serial ID interface
|
|
6
|
MOD-DEF0
|
Module Definition 0
|
3
|
Note 3, Grounded in
Module
|
|
7
|
Rate Select
|
Select between
full or reduced
receiver bandwidth
|
3
|
Note 4
Low or Open – reduced bandwidth,
High– full bandwidth
|
|
8
|
LOS
|
Loss of Signal
|
3
|
Note 5
|
|
9
|
VeeR
|
Receiver Ground
|
1
|
Note 6
|
|
10
|
VeeR
|
Receiver Ground
|
1
|
Note 6
|
|
11
|
VeeR
|
Receiver Ground
|
1
|
Note 6
|
|
12
|
RD-
|
Inv. Received Data
Out
|
3
|
Note 7
|
|
13
|
RD+
|
Received Data Out
|
3
|
Note 7
|
|
14
|
VeeR
|
Receiver Ground
|
1
|
Note 6
|
|
15
|
VccR
|
Receiver Power
|
2
|
3.3 ± 5%, Note 8
|
|
16
|
VccT
|
Transmitter Power
|
2
|
3.3 ± 5%, Note 8
|
|
17
|
VeeT
|
Transmitter
Ground
|
1
|
Note 6
|
|
18
|
TD+
|
Transmit Data In
|
3
|
Note 9
|
|
19
|
TD-
|
Inv. Transmit Data
In
|
3
|
Note 9
|
|
20
|
VeeT
|
Transmitter
Ground
|
1
|
Note 6
|
Plug Seq.: Pin engagement sequence during hot plugging.
1) TX Fault is an open collector/drain output, which should be
pulled up with a 4.7K – 10KW resistor on
the host board. Pull up voltage between
2.0V and VccT, R+0.3V. When high,
output indicates a laser fault of some kind.
Low indicates normal operation. In the low state, the output will be
pulled to < 0.8V.
2)
TX disable is an
input that is used to shut down the transmitter optical output. It is pulled up within the module with a 4.7
– 10 KW
resistor. Its states are:
Low (0 –
0.8V): Transmitter on
(>0.8, < 2.0V): Undefined
High (2.0 – 3.465V): Transmitter
Disabled
Open: Transmitter
Disabled
Table 1 Notes (Cont.)
3)
Mod-Def 0,1,2. These are the module definition pins. They should be pulled up with a 4.7K – 10KW resistor on the host board. The pull-up voltage shall be
VccT or VccR (see Section IV for further details).
Mod-Def 0 is grounded by the module to indicate that the module is present
Mod-Def 1 is the clock line of two wire serial interface for serial ID
Mod-Def 2 is the data line of two wire serial interface for serial ID
4)
This is an optional
input used to control the receiver bandwidth for compatibility with multiple
data rates (most likely Fibre Channel 1x and 2x Rates). If implemented, the input will be internally
pulled down with > 30kW resistor. The
input states are:
Low (0 – 0.8V): Reduced
Bandwidth
(>0.8 , < 2.0V): Undefined
High (2.0 – 3.465V): Full Bandwidth
Open: Reduced
Bandwidth
5)
LOS (Loss of Signal)
is an open collector/drain output, which should be pulled up with a 4.7K – 10KW resistor. Pull up voltage between 2.0V and VccT,
R+0.3V. When high, this output
indicates the received optical power is below the worst-case receiver
sensitivity (as defined by the standard in use). Low indicates normal operation. In the low state, the output will
be pulled to < 0.8V.
6)
VeeR and VeeT may be
internally connected within the SFP module.
7)
RD-/+: These are the
differential receiver outputs. They are
AC coupled 100 W differential
lines which should be terminated with 100 W
(differential) at the user SERDES. The
AC coupling is done inside the module and is thus not required on the host
board. The voltage swing on these lines
will be between 370 and 2000 mV differential (185 – 1000 mV single ended) when
properly terminated.
8)
VccR and VccT are the
receiver and transmitter power supplies.
They are defined as 3.3V ±5% at the SFP connector pin. Maximum supply current is 300 mA. Recommended host board power supply filtering is shown below.
Inductors with DC resistance of less than 1W should
be used in order to maintain the required voltage at the SFP input pin with
3.3V supply voltage. When the
recommended supply filtering network is used, hot plugging of the SFP
transceiver module will result in an inrush current of no more than 30 mA
greater than the steady state value.
VccR and VccT may be internally connected within the SFP transceiver
module.
9)
TD-/+: These are the
differential transmitter inputs. They
are AC-coupled, differential lines with 100W
differential termination inside the module. The AC coupling is done inside the
module and is thus not required on the host board. The inputs will accept differential swings of 500 – 2400 mV (250
– 1200 mV single-ended), though it is recommended that values between 500 and
1200 mV differential (250 – 600 mV single-ended) be used for best EMI
performance.
Figure 2A. Recommended Host Board Supply Filtering Network
Figure
2B. Example SFP Host Board Schematic
B3.
Timing Requirements
of Control and Status I/O
The timing requirements of the control and status lines are drawn largely from
the GBIC standard at the time of writing.
They are summarized in Table 2 below:
Table 2.
Timing Requirements of Control and Status I/0
|
Parameter
|
Symbol
|
Min
|
Max
|
Unit
|
Condition
|
|
TX
Disable Assert Time
|
t_off
|
|
10
|
ms
|
|
|
TX Disable Negate
Time
|
t_on
|
|
1
|
ms
|
|
|
Time to initialize,
including reset of TX_Fault
|
t_init
|
|
300
|
ms
|
From power on or
negation of TX Fault using TX Disable
|
|
TX Fault Assert
Time
|
t_fault
|
|
100
|
ms
|
Time from fault to
TX fault on.
|
|
TX Disable to reset
|
t_reset
|
10
|
|
ms
|
Time TX Disable
must be held high to reset TX_fault
|
|
LOS Assert Time
|
t_loss_on
|
|
100
|
ms
|
Time from LOS state
to RX LOS assert
|
|
LOS Deassert Time
|
t_loss_off
|
|
100
|
ms
|
Time from non-LOS
state to RX LOS deassert
|
|
Rate-Select Change
Time
|
t_ratesel
|
|
10
|
ms
|
Time from rising or
falling edge of Rate Select input until receiver bandwidth is in conformance
with appropriate specification.
|
|
Serial ID Clock
Rate
|
f_serial_clock
|
|
100
|
kHz
|
|
SFP
transceiver power on initialization procedure, TX_DISABLE negated.During power on of the SFP transceiver,
TX_FAULT, if implemented, may be asserted (High) as soon as power supply
voltages are within specification. For transceiver initialization with
TX_DISABLE negated, TX_FAULT shall be negated when the transmitter safety
circuitry, if implemented, has detected that the transmitter is operating in
its normal state. If a transmitter fault has not occurred, TX_FAULT shall be
negated within a period t_init from the time that VCCT exceeds the
specified minimum operating voltage (see Table 2). If TX_FAULT remains asserted
beyond the period t_init, the host may assume that a transmission fault has
been detected by the transceiver.
SFP
transceiver power on initialization procedure, TX_DISABLE negated (Cont.)
If no transmitter safety circuitry is
implemented, the TX_FAULT signal may be tied to its negated state.
The power-on initialization timing for
a transceiver with TX_DISABLE negated is shown in Figure 3.
Figure 3. Power on
initialization of SFP transceiver, TX_DISABLE negated
SFP transceiver power on initialization procedure, TX_DISABLE
asserted.
For SFP transceiver power on
initialization with TX_DISABLE asserted, the state of TX_FAULT is not defined
while TX_DISABLE is asserted. After TX_DISABLE is negated, TX_FAULT may be
asserted while safety circuit initialization is performed. TX_FAULT shall be
negated when the transmitter safety circuitry, if implemented, has detected
that the transmitter is operating in its normal state. If a transmitter fault
has not occurred, TX_FAULT shall be negated within a period t_init from the
time that TX_DISABLE is negated. If TX_FAULT remains asserted beyond the period
t_init, the host may assume that a transmission fault has been detected by the
transceiver.
If no transmitter safety circuitry is
implemented, the TX_FAULT signal may be tied to its negated state. The power-on initialization timing for a SFP
transceiver with TX_DISABLE asserted is shown in Figure 4.
Figure 4. Power on initialization of SFP, TX_DISABLE
asserted
Initialization
during hot plugging of SFP TRANSCEIVER.When a transceiver is not installed, TX_FAULT is held to the
asserted state by the pull up circuits on the host. As the SFP transceiver is
installed, contact is made with the ground, voltage, and signal contacts in the
specified order. After the SFP has determined that VCCT has reached
the specified value, the power on initialization takes place as described in
the above sections. An example of
initialization during hot plugging is provided in Figure 5.
Figure
5. Example
of initialization during hot plugging,
TX_DISABLE negated.
SFP
transmitter management
